The use and pain points of Dingge synchronous belt module in the semiconductor industry

In the semiconductor industry, although synchronous belt modules are widely used, there are many thorny pain points

Accuracy is difficult to guaranteeIt is the primary challenge. The semiconductor manufacturing process has strict requirements for positioning accuracy, often reaching the micrometer or even sub micrometer level. However, the synchronous belt module is constrained by material properties and is prone to thermal expansion and contraction due to temperature changes during operation, resulting in changes in the length of the synchronous belt and causing positioning deviations; After long-term high-frequency use, synchronous belts may experience elastic deformation and tooth wear due to fatigue, further exacerbating accuracy loss and seriously affecting the yield of key processes such as chip manufacturing and wafer inspection

Poor adaptability to the environmentIt also restricts its effectiveness. Semiconductor production is mostly carried out in clean workshops with dust-free and low static electricity. During the transmission process, synchronous belts rub against components such as pulleys and guide rails, which can easily generate fine dust particles and become the source of contaminating wafers and interfering with chip performance; And the corrosive gases generated by photolithography, etching and other processes in the workshop will accelerate the aging of the synchronous belt, greatly shortening its service life

High maintenance costsEqually headache inducing. To maintain accuracy, the synchronous belt needs to be regularly checked and the tension adjusted. Frequent operation not only consumes time and effort, but also often requires production stoppage for coordination, resulting in production interruption; Once the synchronous belt breaks or experiences severe wear, the replacement process becomes complicated, and the new belt needs to be recalibrated and debugged after installation, which increases the downtime of the equipment and significantly increases the overall cost

In addition, synchronous belt modulelack of rigidity，Vibration and displacement are prone to occur under high-speed and high load conditions, making it difficult to meet the increasing demand for high efficiency and precision in semiconductor equipment, which limits its deep application in advanced process equipment

In the face of Dingge ELGA synchronous belt module, these issues are not a problem. In the field of semiconductor manufacturing, which is a arena of precision and efficiency, the performance of linear motion module directly affects equipment efficiency and product yield. Dingge ELGA synchronous belt linear module, with its unique structure - precision integration of linear guide rails, synchronous belts, and aluminum extruded profiles, has become a key component in wafer handling, photolithography, packaging, and other processesKey transmission device，Winning industry favor with high speed, long travel, and excellent cost-effectiveness

1、Core technological advantages：Match the stringent requirements of semiconductors

1. Speed and travel capability：The ELGA module can run at a speed of up to 5m/s above，The itinerary can be extended to4m-6m，Non standard customized solutions can even break through this range, adapting to long-distance high-speed tasks such as cross regional wafer transfer and large cavity cleaning in semiconductor equipment

2. Accuracy level：By optimizing the combination of high-precision belts and guide rails, the repeated positioning accuracy is achieved±0.05mm，After precise calibration by the factory, it can be further improved to0.02mm，Meet the precision requirements for photolithography positioning and wafer cutting

3. Adaptability to clean environment： adopt Low-noise design（The operating noise is significantly lower than that of the screw module），Avoid causing sound pollution to the clean room environmentKey model integrationAntistatic rubber synchronous belt，Effectively prevent electrostatic adsorption particles from contaminating wafers and ensure the cleanliness of the manufacturing environment

4. transmission efficiency：High transmission efficiency98%，Significantly higher than the ball screw module (85% -90%), reducing energy loss, and long-term operation can reduce the total power cost of the equipment

2、Efficient Applications in Semiconductor Manufacturing Scenarios

1.Wafer transfer system：Used for transferring wafers between maintenance furnaces, etching machines, and cleaning machines, reducing the risk of micro scratches and cold caused by vibration through high stability movement, and improving the yield rate

2. Lithography machine motion platform：The acceleration and positioning accuracy of the driving mask stage and wafer stage directly affect the quality of the exposure pattern. The high response speed of ELGA module can shorten the device's cycle time

3. Etching and cleaning equipment：Position the wafer in the etching machine and control the nozzle movement; Immersion and extraction of wafer baskets in cleaning equipment to avoid solution splashing pollution

4. Packaging and testing line：Drive the chip to pick up the robotic arm and cooperate with the vision system to complete high-speed mounting; Transport chips in the testing sorting machine to support high-throughput testing requirements

3、cost performance：The key path to cost reduction in semiconductor equipment

The core advantage of synchronous belt modules lies in their significant cost-effectiveness

1. Low initial investment cost：The price is only for the ball screw module 1/4-1/5，Significantly reduce the initial manufacturing cost of equipment

2. Maintain cost advantage：Simple structure, convenient and low-cost belt replacement; No lubrication requirement, avoid lubricating oil pollution in the clean room, reduce downtime for maintenance

3. Long lifespan and wear resistance：adoptHigh strength rubber synchronous belt，Resistant to high-frequency reciprocating motion, with a lifespan of several years in light to medium load scenarios such as wafer transfer, reducing the frequency of spare parts replacement

4、Industry comparison with ball screw module: positioning application scenarios

The economic logic behind technological choices

In the economic account of precision transmission in semiconductor production, ELGA modules achieve 98% efficiency with 1/5 of the cost——Behind technological substitution lies the industry's pursuit of "sufficient and efficient"